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Recommended Land Pattern
BGA Routing Schemes
Outline of Substrate
Blind vias to ground
reference pla ne layer
recomme nded o n
every oth er row as
shown.
Blind vias to V CC
reference pla ne layer
recomme nded o n
every oth er row as
shown.
Blind vias to ground
reference plane layer
recommended on
every other row as
shown.
Termination Island
Vias to Vcc
Solder mask is
used to define
the ball pads.
Solder Mask Dia = Pad
PCB Pad Diameter
Diameter +.15mm (.006 inch)
1.00 mm Pitch (B7) = 0.51mm/.020 inch
For .006" Thick Solder Paste Stencil, Aperture Opening
Should be Equal to the PCB Pad Diameter.
Refer to www.ctscorp.com/components/clearone.asp for
additional PCB design information
Mechanical Diagram
Option A
Option B
L
H
W
RT_2__B7
CTS YRWK
A1 Identifier
P (Pitch)
K
P (Pitch)
D
1.0mm Pitch
L
W
H
P
D
K
RT1210B7
RT1211B7
RT2210B7
RT2211B7
mm
inch
8.00 ± 0.15
.315 ± .006
3.00 ± 0.15
.118 ± .006
1.19 ± 0.15
.047 ± .006
1.00 ± 0.25
.039 ± .010
0.64 ± 0.05
.025 ± .002
0.50 ± 0.25
.020 ± .010
Complete ClearONE Product, Processing, and Application Information can be found at the following link:
http://www.ctscorp.com/components/clearone.asp
? 2006 CTS Corporation. All rights reserved. Information subject to change
CTS Electronic Components
www.ctscorp.com
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VME64 & VME64x Terminators
April 08
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